- capacity for rigid PCB
- capacity for Flex PCB
- capacity for MPCB
- capacity for PCBA
No.
ITEM
Capabilities
1
Layer
1-18 layer
2
Finished board size
Min:10×10mm;
Max:800×600mm
3
Min. board thickness
2 Layer:0.35mm
4 Layer:0.6mm
6 Layer:1.0mm
8 Layer:1.2mm
10 Layer:1.5mm
4
Max board thickness
7.0mm
5
Copper foil
inner:6oz;outer:4oz
6
Min. conductor width/space
0.076mm
7
Min. mechanical via holes & pad
Holes:0.2mm;
pad:0.4mm
8
Min. laser drilling holes & pad
Holes:0.1mm;
pad<0.1mm
9
Min. space of drilling holes to conductor
0.15mm(<8L);0.2mm(8-14L);0.225mm(>14L)
10
Min. space from conductor/holes to edge
0.15mm(0.2mm)
11
Hole wall to innerlayers' conductor
0.2mm
12
Hole to hole edge gap
0.8mm
13
PTH copper thickness
>0.02mm
14
Hole diameter tolerance
±0.076mm(PTH);±0.05mm(NPTH)
15
Hole positation tolerance
±0.05mm
16
Outline tolerance
±0.15mm(Routing);±0.1mm(Punching)
17
Min. solder mask bridge
0.076mm
18
Solder thickness
0.01-0.02mm
19
Min. solder PAD/Annulus
Pad:0.4mm(laser
drill pad:0.3mm);Annulus:0.1mm
20
Warp&Twist
0.3%-0.7%
21
Thickness of peelablemask
0.2-0.5mm(Max
plugging holes:4.5mm)
22
Bevel angle of gold finger
20°,30°,45°,60°(Tolerance:±5°)
23
Min. Impedance tolerance
±5ohm
24
V-CUT board thickness
0.6-3mm
25
Min tolerance of milling slot
±0.15mm
NO.
ITEM
INSTRUCTION
1
Layer
1-6Layer(polyimide); 1-2Layer(polyeater)
2
Max board thickness
255×550mm
3
Min. board thickness
Single:0.1mm
2 layer:0.13mm
4 layer:0.3mm
6 layer:0.5mm
4
Max board thickness
0.6mm
5
Min. conductor width(W<0.5mm/20mil)
±10%
6
Min. hole size
0.2mm(Drill);0.5mm(Punch);
7
Base copper thickness
1/3-3oz
8
Holes diameter tolerance
±0.025mm(PTH);±0.05mm(NPTH)
9
Hole position tolerance
±0.076mm
10
(Steel Die)Outline tolerance
±0.1mm
11
Fisished board thickness tolerance
±0.03mm
12
Min. width of silkscreen
0.1mm
13
Tolerance after etching
±20%
14
Annular ring single side width(Min)
0.12mm
No.
ITEM
Capabilities
1
Layer
1-6 layer
2
Finished board size
Min:5×5mm;
Max:1185×480mm
3
Min. board thickness
0.3mm
4
Max board thickness
5mm
5
Copper foil
1-6oz
6
Min. conductor width/space
0.1mm
7
Outline tolerance
±0.15mm(Routing);±0.1mm(Punching)
8
Warp&Twist
≤0.5%(1.6mm thickness,300×300mm
dimension)
9
V-CUT tolerance
0.1mm
• PCBA for a wide range of volume, mix and complexity requirements(quick-Turn Prototypes)
• SMT
• Thru-Hole
• BGA, Micro BGA
• Selective Solder
• Fine pitch screen printing/placement down to 8 mil (.008")
• Flip Chip, Chip On Board (COB)
• Tape Automated Bonding (TAB)
Thru-Hole Capabilities
• Ionic contamination testing
• Axial Insertion
• DIP Insertion
• Component Lead Forming
Assembly & Test Capabilities
• X-Ray inspection
• Automated Optical Inspection (AOI)
• In-circuit Test (ICT)
• Product specific functional tests
Box Build
• High end PCBA/enclosure assembly, including firmware loading and full functional test
• Conformal coat